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AI Computing System |
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AI Computing Systems by Vecow are advanced,
ruggedized solutions designed for
high-performance AI applications at the edge.
These systems integrate powerful NVIDIA GPUs and
optimized hardware to enable real-time data
processing, deep learning, and machine vision in
demanding environments. Built for industrial
durability, they operate reliably in extreme
temperatures, vibrations, and shock-prone
settings. Ideal for autonomous vehicles, smart
cities, and industrial automation, Vecow’s AI
systems support scalable, low-latency
decision-making with robust connectivity options
like PoE, CAN, and 5G. Their modular designs
ensure adaptability across sectors like
transportation, robotics, and smart
manufacturing, delivering seamless AI deployment
where reliability and efficiency are critical. |
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Vecow MIG-3000
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The Vecow MIG-3000 Series is a compact,
high-performance AI computing platform built
with 14th Gen IntelŪ Core™ processors and
designed to support discrete GPUs. With
support for dual DDR5 memory up to 64GB,
PCIe x16 expansion for long graphics cards
(up to 900W), and wide-range DC power input,
it is ideal for advanced applications like
Machine Vision, Medical Imaging, Fleet
Management, and AIoT solutions. Its rugged
construction and extended temperature
support ensure reliable performance in
challenging environments. |
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Technical Specifications |
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Category |
Specification |
Processor | IntelŪ CoreT i9/i7/i5/i3 (12th/13th/14th Gen) Up to 24-core CPUs Supports max TDP 65W |
Chipset | IntelŪ H610E |
Memory | 2x DDR5 4800MHz SO-DIMM Up to 64G |
Graphics | Integrated: IntelŪ UHD Graphics 770/730 Discrete GPU: Supported via PCIe x16 (up to 900W) |
Display Outputs | 1x HDMI 1.4 (3840x2160 @30Hz) 1x DisplayPort 1.2a (3840x2160 @60Hz) |
Storage Options | 1x M.2 Key M (2242/2280, PCIe x4/SATA) 2x SATA III |
Expansion | 1x PCIe 4.0 x16 (for 2-slot long GPU) 1x M.2 Key E (2230, PCIe x1/USB2) |
USB Ports | 2x USB 3.2 Type-A 2x USB 2.0 Type-A |
Serial Ports | 2x COM RS-232/422/485 |
LAN | 1x IntelŪ I219V Gigabit LAN 1x IntelŪ I225LM 2.5G LAN |
Audio | RealtekŪ ALC897, 7.1 HD Audio 1x Mic-in, 1x Line-out
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TPM | Infineon SLB9670, TPM 2.0, SPI interface |
Power Input | DC 9V to 55V (2-pin Terminal Block) |
OS Support | Windows 11/10, Linux |
Mounting | Wallmount via mounting brackets |
Dimensions | 162.7mm x 203.0mm x 385.0mm (6.41" x 7.99" x 15.16") |
Weight | 5.3 kg (11.45 lbs) |
Operating Temp. | 0°C to 60°C (32°F to 147°F) |
Storage Temp. | -20°C to 80°C (-4°F to 176°F) |
Humidity | 5% to 90% RH, non-condensing |
Certifications | CE, FCC, ICES, EN50155, EN50121-3-2 Shock/Vibration: IEC 61373:2010 |
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High-Performance Fanless Systems |
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Vecow’s High-Performance Fanless Systems are
rugged, industrial-grade solutions engineered
for mission-critical applications in extreme
environments. Combining powerful IntelŪ or ARM
processors with fanless thermal design, these
systems deliver reliable, maintenance-free
operation in temperatures ranging from -40°C to
70°C. Built to withstand shock, vibration, and
dust, they excel in industrial automation,
transportation, and smart infrastructure.
Equipped with versatile I/O (PoE, COM, DIO) and
advanced connectivity (5G, M12), they enable
real-time edge computing, IoT integration, and
data-intensive tasks. Vecow’s fanless systems
prioritize durability, low power consumption,
and compliance with MIL-STD standards for
seamless, fail-safe performance. |
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Vecow ECX-4000 |
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The Vecow ECX-4000 is a rugged,
high-performance fanless embedded system
built for next-generation edge AI
applications. Powered by IntelŪ Core™ Ultra
200S processors (Arrow Lake-S) with up to 24
cores and integrated AI acceleration (NPU +
IntelŪ Xᵉ Graphics), it delivers up to 36
TOPS of AI performance. Designed for
in-vehicle computing, public safety,
intelligent logistics, and industrial
automation, the ECX-4000 combines powerful
compute capabilities with versatile
connectivity, real-time features, and robust
environmental tolerance. |
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Technical Specifications |
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Category |
Specification |
Processor | IntelŪ CoreT Ultra 200S Series (Arrow Lake-S), up to 24 cores (P-core + E-core hybrid), up to 65W TDP |
Integrated AI | IntelŪ NPU (AI Boost), up to 36 TOPS; IntelŪ X? LPG Graphics with up to 4 engines |
Memory | 2x DDR5 6400MHz CSODIMM, up to 96GB (ECC/non-ECC) |
Display Outputs | 2x DisplayPort (8K), 1x HDMI 2.0 (4K), 1x DVI-I (Full HD) |
Ethernet Ports | - Up to 9 total LAN ports: . 2x 10G SFP+ (IntelŪ X710) . 4x 2.5G PoE+ (IEEE 802.3at) . 3x 2.5G LAN . 1x GigE with iAMT support |
USB Ports | 6x USB 3.2 Gen 2 |
Serial Ports | 4x COM (RS-232/422/485) |
Digital I/O | 16x Isolated DIO (8 DI / 8 DO, optional) |
Storage Options | 2x 2.5" SATA III SSD trays (front-access), optional 2x M.2 front-access sockets, 1x internal M.2 2280 (PCIe x4) |
Expansion Slots | 2x M.2 Key B, 1x M.2 Key E, Optional SUMIT A & B |
Wireless Support | 5G / WiFi 7 / BT / 4G / LTE / GPRS / UMTS via M.2 & SIM slots |
Audio | RealtekŪ ALC888S-VD, 7.1 CH HD Audio (1x Mic-in, 1x Line-out) |
Power Input | Dual DC 9V-50V (Redundant), 3-pin Terminal Block |
Ignition Control | 16-mode Software Ignition, Remote Power Switch |
Security/Manageability | TPM 2.0, IntelŪ vPro, TSN, TCC, PXE, Wake-on-LAN, Watchdog Timer |
OS Support | Windows 11/10, Linux |
Certifications | CE, FCC, ICES, EN50155, EN50121-3-2 |
Environmental | - Operating Temp: -40°C to 75°C (varies by model & CPU TDP) - Storage Temp: -40°C to 85°C - Humidity: 5%-95% (non-condensing) |
Shock/Vibration | Shock: 50G @ wallmount, IEC 60068-2-27 Vibration: 5Grms, IEC 60068-2-64 |
Dimensions | 260mm x 175mm x 79mm (10.24" x 6.89" x 3.11"), Weight: 3.8kg |
Mounting Options | Wallmount (default), optional DIN Rail and 2U Rackmount |
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Ultra-Compact Embedded Systems |
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Vecow’s Ultra-Compact Embedded Systems offer
space-efficient, high-reliability computing
solutions for edge applications in constrained
environments. Designed with rugged, fanless
architectures, these systems operate seamlessly
in extreme temperatures (-40°C to 70°C) and
withstand shock, vibration, and dust. Powered by
IntelŪ or ARM processors, they deliver robust
performance for real-time data processing, IoT
integration, and industrial automation. Compact
yet feature-rich, they include versatile I/O (PoE,
USB, COM) and modern connectivity (5G, Wi-Fi,
M12) for smart factories, autonomous mobile
robots, and transportation. MIL-STD certified
and energy-efficient, Vecow’s ultra-compact
systems ensure fail-safe operation in harsh
settings like logistics, energy, and public
infrastructure, balancing power with minimal
footprint. |
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Vecow ECS-4700
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The Vecow ECS-4700 is an EN60945-certified,
fanless rugged embedded system designed for
AI and edge computing in harsh marine and
industrial environments. Featuring 13th Gen
IntelŪ Core™ i7/i5 processors with built-in
AI acceleration and up to 96GB DDR5 memory,
the ECS-4700 ensures high performance,
reliability, and extended connectivity. With
its isolated power input, PoE+ support,
EN60945 compliance, and wide temperature
operation, it's built for mission-critical
applications including marine,
transportation, and industrial automation. |
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Technical Specifications |
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Category |
Specification |
Processor | 13th Gen IntelŪ CoreT i7-1370PE, 14-core (Raptor Lake-P), 28W TDP |
Chipset | IntelŪ SoC |
Graphics | IntelŪ Iris Xe Graphics, 4K support via DP/HDMI/USB-C |
Memory | Up to 96GB DDR5 5200MHz SO-DIMM (2 slots) |
Storage | - 2x Front-access 2.5" SATA III SSD/HDD trays (RAID 0/1) - 1x M.2 Key M (PCIe x4) |
Expansion Slots | - 1x M.2 Key B (5G/4G, SIM slot) - 1x M.2 Key E (WiFi) |
Display Outputs | - 2x DisplayPort 1.4a - 1x HDMI 2.0 - 1x DP via USB Type-C |
USB Ports | - 2x USB 3.2 Gen 2 Type-A - 1x USB 3.2 Gen 2x2 Type-C - 2x USB 2.0 |
Serial Ports | 4x COM RS-232/422/485 |
DIO | 16 Isolated DIO (8 DI / 8 DO) |
LAN Ports | - 2x 2.5GigE (IntelŪ I226, TSN support) - 4x PoE+ GigE (IntelŪ I350, 25.5W each, 35W total budget) |
Wireless Support | Supports 5G, WiFi, 4G/LTE, GPRS, UMTS via SIM and M.2 |
Audio | Realtek ALC888S-VD, 7.1 HD Audio, 1x Mic-in, 1x Line-out |
Power Input | Dual Redundant DC 9V-50V, Software Ignition Control |
Certifications | EN60945, EN50155, EN50121-3-2, CE, FCC |
OS Support | Windows 11/10, Linux |
Security & Manageability | TPM 2.0 (Infineon SLB9672), Intel vPro, TSN, TCC, Wake-on-LAN, PXE |
Dimensions | 256.8mm x 141.0mm x 54.9mm (10.11" x 5.55" x 2.16") |
Weight | 2.2kg (4.8 lbs) |
Mounting Options | Wall mount (default), Optional VESA/DIN rail mount |
Operating Temp. | -25°C to 75°C (fanless, with airflow) |
Storage Temp. | -40°C to 85°C |
Humidity | 5% to 95%, non-condensing; 95% @ 75°C |
Shock/Vibration | IEC 60068-2-27 (Shock), IEC 60068-2-64 (Vibration) |
AI & Vision Support | Fully supports IntelŪ OpenVINO Toolkit, GigE Vision, USB Vision |
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Expandable Fanless System |
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Vecow’s Expandable Fanless Systems are modular,
rugged computing solutions designed for scalable
industrial applications in extreme environments.
Featuring a fanless, dustproof design, these
systems operate reliably in temperatures from -
40°C to 70°C, with resistance to shock,
vibration, and humidity. Built with IntelŪ
processors and PCI/PCIe expansion slots, they
support customizable I/O (PoE, USB, COM, DIO)
and advanced connectivity (5G, M12) for edge
computing, machine vision, and AIoT deployments.
Vecow’s expandable systems offer flexible
upgrades, MIL-STD compliance, and robust power
efficiency. Their adaptable architecture ensures
seamless integration in harsh settings,
balancing high performance with future-proof
scalability. |
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Vecow ECX-3200 |
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The Vecow ECX-3200/3100 Series is a
high-performance, fanless embedded computer
platform designed for harsh industrial
environments and demanding workloads.
Powered by 14th/13th/12th Gen IntelŪ Core™
processors and IntelŪ R680E chipset, it
supports up to 96GB DDR5 memory, rich I/O,
wide power input, advanced PoE+, PCIe
expansion, and operates in extreme
temperatures. Ideal for Machine Vision, AI
at the Edge, Smart Retail, Rolling Stock,
and Vehicle Computing. |
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Technical Specifications |
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Category |
Specification |
Processor | IntelŪ CoreT i9/i7/i5/i3 (14th/13th/12th Gen, up to 24 cores) |
Memory | 2x DDR5 5200MHz SO-DIMM, up to 96GB |
Graphics | IntelŪ UHD 770/730 (Xe Architecture), 1x DVI-I, 1x HDMI, 2x DisplayPort |
LAN Ports | 4x 2.5GigE PoE+ (IEEE 802.3at), 2x GigE LAN |
USB Ports | 6x USB 3.2 Gen 2 Type-A, 1x USB 3.2 Gen 2x2 Type-C (20Gbps, 15W) |
Serial Ports | 4x COM (RS-232/422/485) |
Expansion Slots | 1x PCIe x16 (up to 200W), 2x M.2 Key B, 1x M.2 Key E, 1x M.2 Key M, 1x Mini PCIe |
DIO | 32 Isolated DIO (16 DI / 16 DO) |
SIM Slots | 3x Nano SIM (External) |
Storage Options | 2x SATA III (6Gbps), 2x 2.5" SSD/HDD trays, 1x M.2 Key M (PCIe x4) |
Audio | Realtek ALC888S-VD, 7.1 HD Audio, Mic-in, Line-out |
Power Input | DC 9V ~ 50V, 3-pin Terminal Block |
Ignition Control | 16-mode software-controlled |
OS Support | Windows 10/11, Linux |
Security & Mgmt. | TPM 2.0, IntelŪ vPro, TCC, TSN, Wake-on-LAN, PXE, Watchdog |
Operating Temp. | -40°C to 75°C (35W CPU), -40°C to 55°C (65W CPU), Fanless |
Certifications | CE, FCC, EN50155, EN50121-3-2 |
Mounting Options | Wall mount (default), VESA, 2U rack (optional) |
Dimensions | 260mm x 240mm x 79mm |
Weight | 4.5 kg |
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COM/SOM |
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COM/SOM Solutions by Vecow are compact,
high-performance embedded modules designed to
accelerate development of customized industrial
systems. These Computer-on-Module (COM) and
System-on-Module (SOM) platforms integrate
IntelŪ or ARM processors, offering scalable
computing power for AIoT, robotics, and edge
computing. Built for rugged environments, they
support wide temperature ranges (-40°C to 85°C),
shock/vibration resistance, and low power
consumption. With rich interfaces (PCIe, USB,
Ethernet) and support for real-time OS/Linux,
they enable rapid deployment in smart factories,
autonomous vehicles, and medical devices.
Vecow’s COM/SOM modules streamline design
flexibility, reduce time-to-market, and ensure
reliability for mission-critical applications
demanding compact, modular architectures. |
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VCOM-2600 |
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The VCOM-2600 is a high-performance COM
Express Compact Type 6 module built around
the 11th Gen IntelŪ Core™ i7/i5 (Tiger Lake
UP3) processor. It delivers excellent
graphics and computing performance with
support for IntelŪ IrisŪ Xe Graphics and up
to 4 independent display outputs. Featuring
a wide -40°C to 85°C operating range, robust
I/O options including PCIe Gen 3, USB 3.2,
SATA, UARTs, and IntelŪ I219LM Ethernet with
iAMT support, the VCOM-2600 is ideal for
industrial, transportation, and edge
computing applications. |
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Technical Specifications |
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Category |
Specification |
Processor | 11th Gen IntelŪ CoreT i7-1185G7E / i5-1145G7E (Tiger Lake UP3) |
Graphics | IntelŪ IrisŪ Xe Graphics, up to 4 independent displays |
Display Interfaces | Dual-channel 24-bit LVDS, 1 RGB, 3 DDI |
Memory | Up to 2x DDR4 SO-DIMM, 3200MHz |
Storage | 2x SATA III (6Gbps) |
USB Ports | 4x USB 3.2, 8x USB 2.0 |
UART Ports | 2x UART (RX/TX support) |
Ethernet | IntelŪ I219LM PCIe GbE PHY, supports iAMT |
Audio | Realtek ALC88S-VD codec on baseboard, HAD bus |
Expansion | 1x PCIe x4 (from CPU, not configurable as 4 x1), 4x PCIe x1 |
TPM | Infineon SLB9670, TPM 2.0, SPI Interface (optional) |
HW Monitoring | Temperature and voltage monitoring with auto CPU throttling |
Power Input | ATX: 12V ą 5% / 5Vsb ą 5% or AT: 12V ą 5% |
Operating Temp. | -40°C to 85°C (with fan sink) |
Storage Temp. | -40°C to 85°C |
Humidity | 5% to 95%, non-condensing; Relative: 95% @ 85°C |
Dimensions | 95mm x 95mm (3.74" x 3.74") - COM Express Compact |
Form Factor | PICMG COM.0 Rev 3.0 Type 6 |
Certifications | CE, FCC |
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Industrial Motherboards |
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Vecow’s Industrial Motherboards are rugged,
high-reliability computing cores engineered for
demanding industrial environments. Built to
endure extreme temperatures (-40°C to 85°C),
shock, and vibration, these motherboards feature
IntelŪ or ARM processors for robust performance
in automation, transportation, and energy
sectors. With rich I/O (PCIe, USB, LAN, COM) and
support for expansion slots, they enable
flexible customization for edge AI, machine
vision, and IoT applications. Compliant with
industrial standards like MIL-STD and EN 50155,
they ensure long-term stability in harsh
settings like factories, railways, and smart
grids. Vecow’s solutions prioritize scalability,
power efficiency, and seamless integration,
delivering durable, future-proof computing for
mission-critical systems. |
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Vecow EMBC-7000 |
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The Vecow EMBC-7000 is a rugged 3.5”
Embedded Single Board Computer, powered by
the latest IntelŪ Core™ Ultra 14th Gen
processors. It combines cutting-edge CPU/GPU/NPU
architecture for optimal performance and
power efficiency. Designed for industrial
and edge AI applications, the EMBC-7000
supports 2.5G LAN, USB 3.2 Gen 2x2, and up
to 4 independent displays, including HDMI
2.1, DisplayPort 1.4, and eDP. With a wide
operating temperature range of -40°C to 75°C
and DC 9V to 55V power input, the EMBC-7000
is perfect for factory automation,
intelligent vending, smart retail, and
robotic applications. |
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Technical Specifications |
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Category |
Specification |
Processor | IntelŪ CoreT Ultra 7 165U Processor (12 Cores) |
NPU | IntelŪ AI Boost (11 TOPS AI performance) |
Chipset | IntelŪ SoC |
BIOS | AMI BIOS |
Memory | 1x DDR5 SO-DIMM, up to 48GB (5600MHz) |
Graphics | IntelŪ Graphics |
Display Support | 4 Independent Displays: - HDMI 2.1 (Up to 4096x2304 @60Hz) - 2x DisplayPort 1.4 (Up to 4096x2304 @60Hz) - eDP (Up to 3840x2400 @120Hz) |
Ethernet | 2x IntelŪ I226 2.5GigE LAN (supports TSN) |
Audio | Realtek ALC888S-VD, 7.1 Channel HD Audio, Mic-in, Line-out |
USB Ports | 2x USB 3.2 Type-A, 1x USB 3.2 Gen 2x2 Type-C with Display, 1x USB 2.0 |
Expansion | 1x SUMIT B Connector, 3x M.2 Sockets (PCIe 4.0 x4, x2, USB 3.0, etc.) |
Storage | 1x SATA III (6Gbps), 2x M.2 (PCIe x4, x2) |
Power Input | DC 9V to 55V (ATX Power Connector), Ignition Control (16-mode software) |
TPM | Infineon SLB9672, TPM 2.0, SPI Interface |
Watchdog Timer | Reset: 1 to 255 sec./min. per step |
Temperature | Operating: -40°C to 75°C, Storage: -40°C to 85°C |
Humidity | 5% to 95% non-condensing, 95% at 75°C |
Dimensions | 146.0mm x 102.0mm (5.75" x 4.02") |
Certifications | CE, FCC, ICES |
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Industrial Multi-Touch Panel PC/Display |
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Industrial Multi-Touch Panel PCs/Displays by
Vecow are rugged, high-visibility interfaces
built for harsh industrial environments.
Featuring IP65/66-rated enclosures, anti-scratch
glass, and wide-temperature operation (-30°C to
70°C), they withstand dust, moisture,
vibrations, and extreme conditions. Powered by
IntelŪ or ARM processors, these panels offer
responsive capacitive/projective capacitive
touchscreens with sunlight-readable displays for
outdoor use. Ideal for factory automation,
logistics, and transportation, they support
diverse I/O (PoE, USB, COM) and connectivity
(Wi-Fi, 5G) for real-time control and HMI
applications. Compliant with EN 50155 and
MIL-STD standards, Vecow’s solutions ensure
reliable, intuitive interaction in smart
manufacturing, energy, and mission-critical
settings. |
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MTC-9021W |
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The MTC-9021W is a robust 21.5" industrial
touchscreen panel PC powered by the 11th Gen
IntelŪ Core™ i7/i5/i3 (Tiger Lake UP3)
processors. It features a full HD 10-point
projected capacitive touch screen and is
designed for industrial applications, with a
fanless design supporting wide temperature
ranges (-5°C to 55°C). The unit also boasts
IP65 front panel protection, ensuring
durability in challenging environments. This
product offers flexible connectivity options
with 1 GigE LAN, 2.5G LAN, multiple USB
ports, and expansion options through M.2
slots for 5G, WiFi, and storage. |
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Technical Specifications |
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Category |
Specification |
Panel | Full HD TFT LED LCD, 21.5" |
Max. Resolution | 1920 x 1080 (Full HD) |
Brightness | 250 cd/mē |
Viewing Angles (H/V) | 178° / 178° |
Contrast Ratio | 3000:1 |
Touch Screen | 10-point Projected Capacitive |
Touch Transparency | ? 91% |
Surface Hardness | 7H Surface Hardness |
Control Interface | USB Type |
Processor | IntelŪ CoreT i7/i5/i3 (Tiger Lake UP3) Quad-Core |
Chipset | IntelŪ SoC (Tiger Lake UP3) |
Memory | 1 x DDR4 3200MHz SO-DIMM, up to 32GB |
Graphics | IntelŪ IrisŪ Xe Graphics |
Serial Ports | 2 x COM RS-232/422/485 (ESD 8kV, DB9 Type) |
USB Ports | 2 x USB 3.1, 2 x USB 2.0 |
Ethernet | 1 x IntelŪ I219LM GigE, 1 x IntelŪ I225 2.5 GigE |
Display Ports | 2 x DisplayPort (up to 4096x2304 @60Hz) |
SIM Card | 1 x Internal Nano SIM Card Socket |
Expansion Slots | 1 x M.2 Key B Socket (3042/3052), 1 x M.2 Key E Socket (2230) |
Storage | 1 x SATA III (6Gbps), 1 x M.2 Key B Socket (2260) |
Storage Device | 1 x 2.5" SSD/HDD Kit |
Power Input | 9V to 55V DC-in |
Power Interface | 3-pin Terminal Block (V+, V-, Frame Ground) |
TPM | Infineon SLB9670, TPM 2.0 |
Watchdog Timer | Reset 1 to 255 sec./min. per step |
Smart Management | Wake on LAN, PXE supported |
OS Support | Windows 10, Linux |
Dimensions | 537.8mm x 329.0mm x 77.1mm (21.17" x 12.95" x 3.04") |
Weight | 6.35 kg (13.99 lb) |
Mounting | Panel Mount, VESA Mount (75 x 75, 100 x 100) |
Operating Temp | -5°C to 55°C (23°F to 131°F) |
Storage Temp | -20°C to 60°C (-4°F to 140°F) |
Humidity | 5% to 95% non-condensing |
Shock | IEC 60068-2-27, 20G, Half-sine, 11ms |
EMC Compliance | CE, FCC |
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